Gold (Au) Bonding Wire

Description

Gold (Au) bonding wire is one of the most commonly used types of wire in the semiconductor industry for creating wire bonds between a semiconductor die and its package. It is known for its excellent electrical conductivity, good thermal conductivity, and high reliability.

Gold bonding wire is typically made from high-purity gold, which has a purity level of 99.99% or higher. The wire is usually supplied in spools and is available in various diameters, ranging from 12.5 to 50 microns.

Gold wire bonds are created using a wire bonding machine that uses ultrasonic energy to bond the wire to the bond pad on the die and the lead frame or substrate. The wire is first fed through a flame to create a small ball at the end of the wire, which is then placed on the bond pad. The machine then uses heat, pressure, and ultrasonic energy to bond the wire to the pad. The other end of the wire is then bonded to the lead frame or substrate.

Gold bonding wire offers several advantages over other types of wire, including:

• High conductivity: Gold has one of the highest electrical conductivities of all metals, which means it can efficiently conduct electricity through the wire bond.
• Good thermal conductivity: Gold also has good thermal conductivity, which means it can efficiently transfer heat away from the die and into the package.
• High reliability: Gold bonding wire is known for its high reliability and long lifespan. It can withstand harsh environmental conditions, such as high temperatures and humidity, without degrading or breaking.
• Compatibility with many materials: Gold bonding wire is compatible with many different materials commonly used in semiconductor packaging, including epoxy, ceramic, and plastic.
• Low corrosion rate: Gold is resistant to corrosion, which means it can maintain its conductivity and reliability over time.

In summary, gold bonding wire is a popular choice in the semiconductor industry due to its high electrical and thermal conductivity, high reliability, and compatibility with many materials. It is commonly used in high-performance devices that require a long lifespan and high reliability, such as automotive and aerospace applications.

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