Gold (Au) Bumping Wire

Description

Gold (Au) bumping wire is a type of wire used in the semiconductor industry to create small bumps or pillars on the surface of a semiconductor die. These bumps or pillars provide a connection point for the die and the package or substrate.

The wire is made from high-purity gold with a purity level of 99.99% or higher and is supplied in spools with various diameters ranging from 5 to 50 microns.

The process of creating gold bumps involves depositing a layer of gold on the surface of the die using a deposition process such as sputtering or evaporation. The gold wire is then used to create small bumps or pillars on the gold layer using a wire bonding machine.

The machine uses heat and pressure to bond the wire to the gold layer and create the bumps or pillars. Gold bumping wire has several advantages over other bumping materials, including high conductivity, good thermal conductivity, high reliability, and compatibility with many materials.

Gold bumping wire is widely used in high-performance devices that require a long lifespan and high reliability, such as automotive and aerospace applications. It is also used in advanced packaging technologies, such as flip-chip and wafer-level packaging.

In summary, Gold (Au) bumping wire plays a critical role in the semiconductor industry for creating connection points between a semiconductor die and its package or substrate, and offers several advantages such as high conductivity, thermal conductivity, and reliability.

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