LED and VCSEL Packages
LED and VCSEL Packages
Description
LED and VCSEL packages are types of electronic packages used in the semiconductor industry to house and protect light-emitting diodes (LEDs) and vertical-cavity surface-emitting lasers (VCSELs), which are used in a wide range of applications such as lighting, displays, communications, and sensing.
LED and VCSEL packages are designed to provide mechanical support and electrical connectivity to the LED or VCSEL die, while also providing efficient thermal management to dissipate the heat generated by the device.
LED packages typically consist of a plastic or ceramic body with a lens, which encapsulates the LED die and provides optical functionality such as beam shaping and color mixing. The body may also include a reflector to improve light extraction efficiency, and the package may be designed for through-hole or surface-mount mounting.
VCSEL packages, on the other hand, typically consist of a ceramic or metal base with a top metal contact, which forms the cavity for the VCSEL die. The cavity may also include a microlens to improve coupling efficiency with external optical fibers, and the package may be designed for through-hole or surface-mount mounting.
Both LED and VCSEL packages may also include additional features such as electrical contacts, wire bonds, and thermal interface materials to enhance the performance and reliability of the device.
LED and VCSEL packages play a critical role in protecting and ensuring the reliable operation of LEDs and VCSELs in various applications, making them a vital component in the semiconductor industry.
| No. | Material (Code) | Thermal Conductivity | Drawing No. | Unit Design | Array Size AxB | Unit Size CxD | Cavity Depth | Thickness H | Cavity Size | S/R Pattern | Plating/ Metallization | pcs/ Array | Notes (*) | |||||
| E | F | G | I | J | K | |||||||||||||
| Top | Bottom | |||||||||||||||||
| 1 | (AN242) | 150W/mK | KD-LB9H42 |  | 58.8 x 45.5 | 3.45SQ | 0.40 | - | - | 0.80 | 2.40SQ | - | - | With | Ni-Au | 130pcs/ Array | F/C Model | |
| 2 | (AN242) | 150W/mK | KD-LB9H44 |  | 58.8 x 45.5 | 3.45SQ | 0.40 | - | - | 0.80 | 2.40SQ | - | - | Without | Ni-Au | 130pcs/ Array | F/C Model | |
| 3 | (AN242) | 150W/mK | KD- LB6T90 |  | 58.8 x 45.5 | 3.45SQ | 0.60 | - | - | 0.90 | 2.40SQ | - | - | With | Ni-Au | 130pcs/ Array | W/B Model | |
| 4 | AlN (AN242) | 150W/mK | KD- LB7319 |  | 58.8 x 45.5 | 6.8SQ | 0.40 | - | - | 1.00 | 4.90dia. | - | - | With | Ni-Au | 35pcs/ Array | Multi Chip Model | |
| 5 | AlN (AN242) | 150W/mK | KD- LB8B43 |  | 58.8 x 45.5 | 6.8SQ | 0.50 | - | - | 1.10 | 4.90dia. | - | - | With | Ni-Au | 35pcs/ Array | Multi Chip Model | |
| 6 | Alumina (A440) | 14W/mK | KD- LB9761 |  | 68.48 x 85.00 | 3.5SQ | 0.20 | 0.425 | - | 1.125 | 2.56SQ | 2.06dia. | - | Without | Ni-Au | 336pcs/ Array | F/C Model | |
| 7 | Alumina (A440) | 14W/mK | KD- LB9203 |  | 68.48 x 85.00 | 3.5SQ | 0.20 | 0.40 | - | 1.10 | 2.56SQ | 2.06dia. | - | Without | Ni-Au | 336pcs/ Array | W/B Model | |
| 8 | AlN (AN242) | 150W/mK | KD-RB9H09 |  | 58.8 x 45.5 | 3.5X3.2 | 0.40 | 0.50 | - | 1.20 | 2.70× 2.50 | 2.1SQ. | - | Without | Ni-Au | 130pcs/ Array | W/B Model | |
| 9 | AlN (AN242) | 150W/mK | KD-RB8L49 |  | 58.8 x 45.5 | 3.5SQ | 0.30 | 0.35 | 0.20 | 1.10 | 3.00x 2.80 | 2.40 x 2.20 with Vent Hole | 1.40 SQ | Without | Ni-Au | 130pcs/ Array | W/B Model | |
| 10 | (AlN170) | 170W/mK | KO-THF190139 |  | 100 x 100 | 3.5SQ | ― | ― | ― | 0.3 | ― | ― | ― | ― | Ni-Pd-Au | 529pcs/ Array | W/B Model | |
| 11 | AlN (AlN170) | 170W/mK | KO-THF190142 |  | 100 x 100 | 3.5SQ | ― | ― | ― | 0.3 | ― | ― | ― | ― | Ni-Pd-Au | 529pcs/ Array | W/B Model with AuSn | |
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