Power packages are a type of electronic package used in the semiconductor industry to house and protect power semiconductor devices such as power transistors, power diodes, and power modules. Power packages are designed to handle high power and high-current applications, and to provide efficient thermal management to dissipate the heat generated by the power devices.
Power packages come in various shapes and sizes, each with different electrical and thermal characteristics to suit different applications. Some common types of power packages include TO-220, TO-247, and D2PAK for discrete power devices, and modules such as power integrated circuits (PICs), insulated gate bipolar transistors (IGBTs), and metal oxide semiconductor field-effect transistors (MOSFETs).
Power packages typically consist of a metal or plastic body, which serves as a mechanical support and electrical connection for the power devices, and a substrate, which provides electrical insulation and thermal management. The substrate may be made of ceramic or a high-thermal-conductivity material such as copper or aluminum.
Power packages may also include additional features such as heatsinks, thermal interface materials, and thermal vias to enhance the thermal management and improve the reliability of the power devices.
Overall, power packages play a critical role in protecting and ensuring the reliable operation of power semiconductor devices in high-power and high-current applications, making them a vital component in the semiconductor industry.
A x B
|43.0 x 32.0||25.0 x 20.5||50.8 x 38.1||20.0 x 22.0||44.0 x 41.4|
|CERAMIC THICKNESS |
C / D
|0.32||0.32||0.32||0.32||0.32 / 0.635|
|Cu THICKNESS |
E / F
|0.2 / 0.2||0.3 / 0.2||0.3 / 0.2||0.5 / 0.5||0.3 / 0.3|
|Cu LEAD LENGTH |
|Fe-Ni-Co SEAL RING |
(PLATING: Ni-P/ Pd/Ag)