RF Power Transistor Packages

RF Power Transistor Packages


RF Power Transistor Packages

RF power transistors are used in high-power applications that require high-frequency signals, such as in radar systems, satellite communications, and broadcast transmitters. The packages for RF power transistors are designed to provide efficient heat dissipation, high reliability, and ruggedness to withstand harsh environments.

There are several types of RF power transistor packages, including:

  1. Metal-Ceramic (Hermetic) Packages: These packages use a metal casing sealed with a ceramic material, providing a hermetic seal that prevents moisture and other contaminants from entering the package. The metal-ceramic packages are used for high-reliability applications such as military and aerospace.
  2. Plastic Packages: These packages are made of plastic materials that provide good insulation and mechanical strength. They are less expensive than hermetic packages but offer lower reliability and are typically used in commercial applications.
  3. Metal Packages: These packages are made of metal materials that provide high thermal conductivity, ruggedness, and excellent electromagnetic interference (EMI) shielding. They are used in high-power and high-frequency applications where EMI is a concern.
  4. Ceramic Packages: Ceramic packages provide excellent thermal conductivity and high mechanical strength, making them suitable for high-power applications. They are also used in applications where high reliability is required, such as in military and aerospace.
  5. Flange-Mount Packages: These packages are designed to be bolted onto a heat sink or other thermal management device, providing efficient heat dissipation. They are commonly used in high-power applications that require high reliability and ruggedness.

RF power transistor packages play a crucial role in ensuring the efficient and reliable performance of high-power applications. The choice of package depends on the specific application requirements, such as thermal management, reliability, and EMI shielding.

  SGMS-97476-C SGMR-B0282 SGMR-B8199 SGMR-A7030-B SGMR-B5227
Heat Sink Material KYCM® KYCM® KYCM® CM360 Cu-Diamond
Lead Count 2 10 14 2 2
Frequency DC~5GHz DC~15GHz DC~30GHz DC~5GHz DC~5GHz
Base Dimension 24.0 x 17.4 24.0 x 17.4 24.0 x 17.4 24.0 x 17.4 24.0 x 17.4
Base Thickness 1.4 1.4 1.4 1.4 1.4
Cavity Dimension 15.2 x 13.0 15.2 x 12.4 15.2 x 12.4 15.2 x 13.0 15.2 x 13.0
Lead Width 0.6 0.30 / 0.60 0.25 / 0.35 / 0.60 0.6 0.6
Lead Length 2.0MIN. 2.0MIN. 3.0 2.0MIN. 2.0MIN.
Lead Height 2.4 2.04 1.78 2.4 2.4

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