Thermal Tape Adhesives and Thermal Epoxies
Thermal Tape Adhesives and Thermal Epoxies
Description
Thermal tape adhesives and thermal epoxies are two types of thermal interface materials (TIMs) used in the semiconductor industry to improve the heat dissipation performance of electronic devices.
Thermal tape adhesives consist of a thin layer of adhesive coated on both sides with a thermally conductive material, such as aluminum or copper. The tape is applied to the surface of the heat source or heat sink, providing a reliable and low-resistance thermal path between the two surfaces.
Thermal epoxies, on the other hand, consist of a two-part epoxy adhesive infused with a thermally conductive filler material, such as silver or aluminum oxide. The two parts are mixed together and applied to the surfaces of the heat source and heat sink, where they harden to form a strong and durable bond.
Both thermal tape adhesives and thermal epoxies offer several benefits in the semiconductor industry, including high thermal conductivity, low thermal resistance, and the ability to conform to non-flat or irregular surfaces. They also provide a reliable and consistent thermal interface, even under conditions of high temperature and mechanical stress.
The selection of the appropriate thermal tape adhesive or thermal epoxy is dependent on various factors such as the specific electronic device, the power density and operating temperature of the device, and the manufacturing process. Manufacturers offer a wide range of thermal tapes and epoxies with different thermal performance, adhesive strength, and curing times to suit different applications.
Overall, thermal tape adhesives and thermal epoxies play a critical role in improving the thermal management performance of electronic devices, ensuring that they operate effectively and efficiently while minimizing the risk of thermal failure.
- Thermal Adhesives and Thermal Epoxies in Dispensing Paste
- Electrically and Thermally Conductive Thermal Epoxies in Dispensing Paste
- Thermally Conductive & Electrically Insulating Thermal Tapes and Thermal Pads in Film Adhesive
| Characteristics | Electrical Resistivity (ohm-cm) | Thermal Conductivity(watt/m-°C) | Die-shear (psi) | Tg (°C) | Viscosity |
|---|---|---|---|---|---|
Stress free One or two component Large bonding areas | <4x10-4 | >6.0 | >1,800 | -20 | 300,000 (cps@ 0.5 rpm) |
Solvent free Stress free | <4x10-4 | >12.5 | >1,200 | -20 | 60,00 (cps@ 2.5 rpm) |
Stress free Mismatched CTE’s | <4x10-4 | >7.9 | >2,400 | -25 | 144,000 (cps@ 0.5 rpm) |
Solder replacement Rapid curing Molecularly flexible More than 7 days pot-life Easily dispensed & screen printable | <4x10-4 | >6.0 | >1,500 | -20 | 15,000 (cps@ 0.5 rpm) TI >4 |
| Characteristics | Electrical Resistivity (ohm-cm) | Thermal Conductivity (watt/m-°C) | Die shear (psi) | Tg (°C) | Film Type |
|---|---|---|---|---|---|
Instant melt-tack >150°C (<10 psi) No curing required Low moisture absorption Proven reliability for large area substrates | >1×1014 | >4.0 | >1000 | -55 | Tack free dry film Preforms 3-12 mils (thick) |
Instant tack with 10 psi for 300 psi bond Insitu curing, no special curing process Proven reliability for large area substrates | >1×1014 | >3.6 | 750 | -25 | Tacky film Preforms 3-12 mils (thick) |
Instant melt-tack >120°C (<10 psi) Curing without fixture and pressure Low moisture absorption Proven reliability for large area substrates | >1×1014 | >2.0 | >1,500 | -45 | Tack free dry film Preforms 3-12 mils (thick) |
Tacky for instant placement without fixture Curing without fixture and pressure Low moisture absorption Proven reliability for large area substrates | >1×1014 | >2.0 | >1,500 | -45 | Tacky film Preforms 3-12 mils (thick) |
Tacky for instant placement without fixture Curing with fixture or low pressure Withstand high temperature excursion Molecularly flexible for low interfacial stress Proven reliability for large area substrates | >1×1014 | >3.6 | >1,500 | -20 | Tacky film Preforms 3-12 mils (thick) |
| Characteristics | Electrical Resistivity (ohm-cm) | Thermal Conductivity (watt/m-°C) | Die shear (psi) | Tg (°C) | Film Type |
|---|---|---|---|---|---|
Instant melt-tack >120°C (<10 psi) Curing without fixture and pressure Withstand >150°C wire-bonding Low moisture absorption Proven reliability for large area bonding | <4x10-4 | >6.0 | >1,500 | -45 | Tack free dry film Preforms 3-12 mils (thick) |
Tacky for instant placement without fixture Curing with fixture or low pressure Withstand high temperature excursion Molecularly flexible for low interfacial stress Proven reliability for large area substrates | <4x10-4 | >8.0 | >1,500 | -25 | Tacky film Preforms 3-12 mils (thick) |
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