WAFER BACKGRINDING AND DICING TAPES
Wafer Backgrinding and Dicing Tapes
Description
Wafer backgrinding and dicing tapes are specialized materials used in the semiconductor industry during the process of thinning and separating wafers into individual die.
Wafer backgrinding is the process of thinning the wafer by grinding away a portion of the substrate from the backside of the wafer to reduce the thickness of the die. Dicing is the process of cutting the wafer into individual die after the backgrinding process is complete.
During these processes, a specialized tape is used to attach the wafer to a carrier substrate, which helps to prevent damage to the die and provide support during grinding and cutting. The tape also acts as a temporary adhesive, holding the thinned wafer in place during subsequent manufacturing steps.
The tape used for backgrinding and dicing is typically made of a polymer material such as polyethylene terephthalate (PET) or polyvinyl chloride (PVC), and is coated with a pressure-sensitive adhesive on one or both sides. The adhesive used on the tape is specifically designed to maintain adhesion strength even at high temperatures and after exposure to chemicals commonly used in semiconductor processing.
The selection of the appropriate backgrinding and dicing tape is dependent on various factors such as the thickness and material of the wafer, the equipment used for the process, and the specific manufacturing requirements. Manufacturers offer a wide range of tapes with different thicknesses, adhesive strengths, and release properties to suit different applications.
Overall, wafer backgrinding and dicing tapes play a critical role in the semiconductor manufacturing process, providing support and protection to delicate semiconductor wafers during thinning and cutting operations.
The standard size for most log rolls is 1200mm width × 100m length.
Customized sizes are available within a maximum width of 1200mm and length of 100m, such as 230mm width × 100m length supplied to some of our customers.
- BACKGRINDING TAPE ADHESIVES for Bumped Wafers
- Wafer-Level Dicing Tape
- Packaged Device Dicing Tape
- QFN/LCC Package Tapes
- Process Tapes for Precision Industries
| PARAMETER | BG-UVR100-PET | BG-HTCR100-PET | BG-HR200-PET |
| Release Mechanism-Material and Thickness | UV Exposed | Controlled Peel | Heat Curing Release |
| Carrier Support Film and Thickness | PET or LCP 75 Microns | PET or LCP 75 microns | PET or LCP 75 microns |
| Thickness of Compressible-Compliant Layer | 150 micron version 300 micron version | 150 micron version 300 micron version | 150 micron version 300 micron version |
| Peel Strength in Operation (gpi) | 100 gpi 250gpi, 500 gpi (option) | 100 gpi 250 gpi, 500 gpi (option) | 200 gpi 100 gpi, 500 gpi (option) |
| Peel Strength for Release (gpi) | 25 gpi nominal | 100 gpi nominal | 25 gpi nominal |
| Operational Temperature Capability | 150°C (PET Version) 250°C (LCP Version) | 150°C (PET Version) 250°C (LCP Version) | Peel lower when exposed to 150°C |
| Chemical Resistance | Outstanding | Outstanding | Outstanding |
| Water Jet Resistance | Outstanding | Outstanding | Outstanding |
| Note #1: All backgrinding and thinning temporary materials are free of silicones or siloxanes. | |||
| Note #2: Anti-static versions are available for all UV, heat or peel release temporary bonding. | |||
| Product | Adhesion Before UV Exposure (Peel, gm/in) | Adhesion After UV Exposure (Peel, gm/in) | Adhesive/Buffer Thickness (Micron) | Backing Material Thickness (Micron) | Compressibility [ ] | Tensile Strength (Kg/cm) | Special Characteristics |
|---|---|---|---|---|---|---|---|
| BG-FC-UVR500 | 500 | 20 | 150 | 125 | [>100 micron] | >200 | Withstand 100°C continuous usage Silicone-Free |
| BG-SB-UVR500 | 500 | 20 | 300 | 125 | [>250 micron] | >200 | Withstand 100°C continuous usage Silicone-Free |
| Product | Push-Off Strength (Die-Shear, psi) | Max. Load Bearing Temp. (°C) | “Melt-Bonding” Temperature & Lamination Process (@14-15psi) |
|---|---|---|---|
| CB7060 (Single ply melt-bonding adhesive film) | >1,000 | 60 | >70°C with heated roll laminator with proper “foam” support >70°C with “vacuum bagging” Low ionic and ease of total removal |
| CB7130 (Single ply melt-bonding adhesive film) | >1,000 | 130 | >130°C with heated roll laminator with proper “foam” support >130°C with “vacuum bagging” Low ionic and ease of total removal |
| CB7350-S (High-tack single-sided adhesive film on a temperature stable liner) | >300 | 150 (Continuous & 300 @5 min.) | Mount wafer-substrate with suitable laminator or with “vacuum bagging” equipment Low ionic and ease of total removal with suitable solvent |
| CB7350-B (High-tack double-sided adhesive film on a temperature stable liner) | >300 | 150 (Continuous & 300 @5 min.) | Mount wafer-substrate with suitable laminator or with “vacuum bagging” equipment Low ionic and ease of total removal with suitable solvent |
| CB7065 (Thermally conductive, single ply melt-bonding adhesive film) | >1,000 | 60 | >70°C with heated roll laminator with proper “foam” support >70°C with “vacuum bagging” Low ionic and ease of total removal |
| CB7135 (Thermally conductive, single ply melt-bonding adhesive film) | >1,000 | 130 | >130°C with heated roll laminator with proper “foam” support >130°C with “vacuum bagging” Low ionic and ease of total removal |
| TK7355-SS (High-tack single-sided adhesive film on a high thermal conductivity film liner) | >300 | 150 (Continuous & 300 @5 min.) | Mount wafer-substrate with suitable laminator or with “vacuum bagging” equipment Low ionic and ease of total removal with suitable solvent |
Release Liner: PET 50um
Adhesive Layer: Acrylic-based / UV-curable 5-15um
Backing: Clear or Blue PO/PVC 80um
Product Features:
- Compatible with a wide range of wafer substrates.
- Stable adhesion ensures minimal chipping and fly-off during dicing.
- Excellent isotropic uniformity for consistent film expansion.
- Clean residue-free release without contamination.
- Also suitable for back-grinding and temporary package protection in certain applications.
| Product Code | Material / Appearance | Backing Thickness (µm) | Adhesive Thickness (µm) | Total Thickness (µm) | Release Liner Thickness (µm) | Adhesion Pre-UV (N/25mm) | Adhesion Post-UV (N/25mm) | Release Condition UV Dosage (mJ/cm²) |
| P4670 | PO | 80±3 | 10±2 | 90±5 | 50±2 | ≥8 | ≤0.15 | 300-500 |
| P4608 | PO Blue | 80±3 | 5±2 | 85±5 | 50±2 | ≥4 | ≤0.15 | 300-500 |
| P6589 | PVC Clear | 80±3 | 10±2 | 90±5 | 50±2 | ≥1.5 | ≤0.15 | 300-500 |
| P6597 | PVC Blue | 80±3 | 10±2 | 90±5 | 50±2 | ≥1.5 | ≤0.1 | 300-500 |
| P6512 | PVC Blue | 80±3 | 10±2 | 90±5 | 50±2 | ≥6 | ≤0.25 | 300-500 |
| P6571 | PVC Clear | 80±3 | 10±2 | 90±5 | 50±2 | ≥7 | ≤0.15 | 300-500 |
| P4623 | PO | 80±3 | 10±2 | 90±5 | 50±2 | 1.5-2.5 | — | Non-UV Release Type |
| P6518 | PVC Blue | 80±3 | 15±2 | 95±5 | 50±2 | 2.0-4.0 | — | Non-UV Release Type |
| P6509 | PVC Blue | 80±3 | 10±2 | 90±5 | 50±2 | ≥0.8 | — | Non-UV Release Type |
Release Liner: PET 50um
Adhesive Layer: Acrylic-based / UV-curable 10-35um
Backing: Clear PO 150um
Product Features:
- Compatible with a wide range of packaging substrates.
- Stable adhesion ensures minimal chipping anddelamination during package singulation.
- Excellent isotropic uniformity for consistent film expansion.
- Clean residue-free release without contamination.
- Customizable to meet specific application requirements.
| Product Code | Recommended Applications | Material / Appearance | Backing Thickness (µm) | Adhesive Thickness (µm) | Total Thickness (µm) | Release Liner Thickness (µm) | Adhesion Pre-UV (N/25mm) | Adhesion Post-UV (N/25mm) | Release Condition UV Dosage (mJ/cm²) |
| P4650 | DFN, QFN, uQFN, uDFN | PO | 150±5 | 25±2 | 175±7 | 50±2 | ≥16 | ≤0.1 | 300-500 |
| P4633 | 140±5 | 15±2 | 155±7 | 50±2 | ≥16 | ≤0.15 | 300-500 | ||
| P4631 | 150±5 | 10±2 | 160±7 | 50±2 | ≥5 | ≤0.1 | 300-500 | ||
| P4637 | 140±5 | 10±2 | 150±7 | 50±2 | ≥7 | ≤0.1 | 300-500 | ||
| P4668 | 150±5 | 10±2 | 160±7 | 50±2 | ≥6 | ≤0.1 | 300-500 | ||
| P4659E | Static Dissipative DFN, QFN | 150±5 | 30±2 | 180±7 | 50±2 | ≥18 | ≤0.1 | 300-500 | |
| P4635 | mLED BGA, CSP | 100±5 | 20±2 | 120±7 | 50±2 | ≥12 | ≤0.5 | 300-500 | |
| P4692 | mLED EMC | 150±5 | 10±2 | 160±7 | 50±2 | ≥8 | ≤0.1 | 300-500 | |
| P4623 | 150±5 | 10±2 | 170±7 | 50±2 | ≥6 | ≤0.1 | 300-500 | ||
| P46165 | mLED Ceramic | 150±5 | 15±2 | 165±7 | 50±2 | ≥10 | ≤0.3 | 300-500 |
Release Liner: PET 50um
Adhesive Layer: Silicone Adhesive 5-10um
Backing: Amber PI 25um
Product Features
- Moderate tack provides reliable adhesion to both copper
and alloy leadframes. - Stable adhesion after high-temperature processes allows for clean and easy removal.
- Excellent anti-bleed and dam-bar resistance properties.
- Customizable to meet specific process requirements.
| Product Code | Recommended Applications | Material / Appearance | Backing Thickness (µm) | Adhesive Thickness (µm) | Total Thickness (µm) | Release Liner Thickness (µm) | Adhesion Strength - Standard Steel Panel (N/25mm) |
| P0119 | QFN Assembly, Molding, Copper Leadframe | PI | 25±2 | 5±2 | 30±4 | 50±2 | 1-2 |
| P0113 | 25±2 | 10±2 | 35±4 | 50±2 | 0.5-1 |
Product Features:
- Excellent adhesion to a wide variety of substrates.
- Consistent tack ensures minimal debris generation during cutting/singulation.
- Robust performance under various process conditions with specialized chemical resistance.
- Clean, residue-free removal without surface contamination.
- Customizable to meet specific application and performance requirements.
| Product Code | Recommended Applications | Material / Appearance | Backing Thickness (µm) | Adhesive Thickness (µm) | Total Thickness (µm) | Release Liner Thickness (µm) | Adhesion Pre-UV (N/25mm) | Adhesion Post-UV (N/25mm) | Release Condition UV Dosage (mJ/cm²) | Temperature & Time |
| P49100 | Ceramic Dicing | PET/Green | 50±2 | 50±3 | 100±5 | 50±2 | ≥8 | - | - | 100-110°C 90s |
| P4920D | Ceramic Dicing | PET/Green | 100±3 | 50±3 | 200±9 | 50±2 | ≥0.4 | Heat-Activated Removal | - | 130-150°C 60s |
| P49221 | Wafer | PET/Blue | 50±2 | 50±3 | 100±5 | 50±2 | ≥8 | - | - | 120°C 90s |
| P4613 | Filter Dicing | PO | 80±3 | 20±2 | 100±5 | 50±2 | ≥10 | ≤0.1 | 300-500 | - |
| P4612 | Filter Dicing | PO | 80±3 | 10±2 | 90±5 | 50±2 | ≥6 | ≤0.1 | 300-500 | - |
| P4651 | Glass Thinning | PO | 150±3 | 35±2 | 185±5 | 50±2 | ≥20 | ≤0.15 | 300-500 | - |
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