AMPLIFIER MMICs
Description
Amplifier MMICs (Monolithic Microwave Integrated Circuits) are semiconductor devices that are designed to provide amplification at microwave frequencies. These chips are made using advanced semiconductor processing techniques, which allows for the integration of multiple components, such as amplifiers, filters, and mixers, onto a single monolithic substrate.
Amplifier MMICs are used in a wide range of applications that require high-frequency amplification, such as in wireless communication systems, radar systems, and satellite communication systems. These chips offer several advantages over traditional discrete amplifiers, including higher integration density, lower noise, and better performance at high frequencies.
One of the key advantages of amplifier MMICs is their integration density. By integrating multiple components onto a single chip, amplifier MMICs can provide high levels of functionality in a small package, which can help to reduce the size and weight of electronic systems.
Amplifier MMICs also offer low noise characteristics, which can help to improve signal quality in communication systems. This is particularly important in wireless communication systems, where signal-to-noise ratio is a critical factor in system performance.
Another advantage of amplifier MMICs is their performance at high frequencies. These chips can operate at frequencies up to tens of GHz or higher, which makes them ideal for use in applications that require high-speed data transfer or low-latency communication.
Amplifier MMIC chips are used in broadband and radar amplifiers, jamming and test equipment amplifiers operating in Ka- band. These chips are based on GaAs and GaN materials and are qualified for space application
| FREQ. MIN (GHz) | FREQ. MAX (GHz) | GAIN (dB) | Psat (dBm) | PAE (%) | BIAS CURRENT (A) | DRAIN VOLTAGE (V) | PACKAGE |
| 18 | 23 | 25 | 33 | 20.2 | 1.2 | 4 | Die |
| 6 | 18 | 20 | 41 | 38 | 2 | 12 | Die |
| 29.5 | 33.5 | 20 | 40 | 31 | 1.2 | 12 | Die |
| 37 | 43 | 22 | 41 | 35 | 2.7 | 12 | Die |
| FREQ. MIN (GHz) | FREQ. MAX (GHz) | GAIN (dB) | NOISE FIGURE (dB) | P1dB OUT (dBm) | SUPPLY CURRENT (A) | SUPPLY VOLTAGE (V) | PACKAGE |
| 0.01 | 46 | 16 | 2 | 21 | 195 | 5 | Die |
| 0.01 | 54 | 13 | 2.5 | 15 | 100 | 5 | Die |
| 0.5 | 45 | 13 | 2.6 | 18 | 85 | 5 | Die |
| 1.5 | 47 | 15 | 2.5 | 19 | 103 | 5 | Die |
| FREQ. MIN (GHz) | FREQ. MAX (GHz) | GAIN (dB) | NOISE FIGURE (dB) | OP1dB (dBm) | BIAS CURRENT (A) | BIAS VOLTAGE (V) | PACKAGE |
| 5 | 7 | 13 | 0.5 | 12 | 1 | 50 | Die |
| 18 | 26 | 19 | 1.5 | 5 | 60 | 0.8 | Die |
| 25 | 43 | 32 | 1.5 | 1 | 30 | 1.1 | Die |
| 8 | 12 | 33 | 1.1 | 11 | 55 | 5 | Die |
| 13 | 15 | 25 | 1 | 8 | 20 | 3.3 | Die |
| 24 | 34 | 24 | 1.3 | 11 | 47 | 3.5 | Die |
| 5 | 6 | 30 | 1 | 15 | 40 | 3 | Die |
| 75 | 110 | 23 | 3 | 1 | 33 | 1 | Die |
| 1 | 12 | 35 | 1.3 | 12 | 52 | 1.5 | Die |
| 8 | 12 | 16 | 1.6 | 17 | 82 | 5 | Die |
| 8 | 12 | 20 | 1.5 | 20 | 160 | 8 | Die |
| 1 | 18 | 35 | 1.5 | 12 | 50 | 1.5 | Die |
| 26 | 34 | 20 | 1.6 | 17 | 90 | 8 | Die |
| 24 | 44 | 25 | 1.5 | 8 | 50 | 1.5 | Die |
| 44 | 70 | 25 | 2 | 5 | 40 | 1.1 | Die |
| 6 | 18 | 9 | 3.3 | 13 | 33 | 5 | Die |
Order Form
About Semiconductor Electronics
SEMI EL project is a global supplier of materials, equipment, spare parts and supplies for the semiconductor industry.
Get In Touch
Email: info@semi-el.com