High Purity Boron Nitride

High Purity Boron Nitride BN-HB


High Purity Boron Nitride BN-HB

High Purity Boron Nitride (BN-HB) is a type of boron nitride material with exceptional purity, typically above 99.99%. BN-HB is made by a variety of methods, including chemical vapor deposition (CVD), high-temperature synthesis, and purification of raw boron nitride materials.

BN-HB has a hexagonal crystal structure similar to graphite, and is often called white graphite due to its similar appearance to graphite. However, unlike graphite, BN-HB is an insulator with exceptional thermal and chemical stability, high thermal conductivity, and high electrical resistance.

Because of these properties, BN-HB has many potential applications in high-tech industries, including electronics, aerospace, and energy. In electronics, it can be used as a high-temperature insulator, a substrate for graphene growth, and a filler material in thermal interface materials for electronic packaging. In aerospace, it can be used as a thermal barrier coating for engine components. In energy, it can be used as a filler material in high-temperature composite materials for nuclear reactors and solar cells.

High Purity Boron Nitride BN-HB is hot-pressing boron nitride ceramics with the high purity boron nitride powder. It can be used in highest temperature (>2200 °C) in inert or vacuum environments. It is an excellent choice for applications where high temperature capabilities and corrosion resistance are important.


● High purity materials (BN>99.5%) and binder-less ceramic.

● No react with metals.

● Highest temperature (2300 °C in inert).


● Crucibles for high-purity molten metals.

● Nozzles for specialty alloys.

● Insulators for high temperature.

● Insulators and protective tubes for high-temperature furnaces.

Grade BN-HB
Compositions BN>99%
Binder Self Binder
Density g/cm3 1.9-2.0
25°C Volume Resistivity Ω·cm >1014
Max. Service Temp. (°C) Oxygen 900
Inert Gas 2300
High Vacuum 1800
Flexural Strength Mpa 25
Compressive Strength Mpa 80
Coefficient of Thermal Expansion 25-1000°C 10-6/K 0-2
Thermal Conductivity W/mK 50

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