Description
High Purity Boron Nitride (BN-HB) is a type of boron nitride material with exceptional purity, typically above 99.99%. BN-HB is made by a variety of methods, including chemical vapor deposition (CVD), high-temperature synthesis, and purification of raw boron nitride materials.
BN-HB has a hexagonal crystal structure similar to graphite, and is often called white graphite due to its similar appearance to graphite. However, unlike graphite, BN-HB is an insulator with exceptional thermal and chemical stability, high thermal conductivity, and high electrical resistance.
Because of these properties, BN-HB has many potential applications in high-tech industries, including electronics, aerospace, and energy. In electronics, it can be used as a high-temperature insulator, a substrate for graphene growth, and a filler material in thermal interface materials for electronic packaging. In aerospace, it can be used as a thermal barrier coating for engine components. In energy, it can be used as a filler material in high-temperature composite materials for nuclear reactors and solar cells.
High Purity Boron Nitride BN-HB is hot-pressing boron nitride ceramics with the high purity boron nitride powder. It can be used in highest temperature (>2200 °C) in inert or vacuum environments. It is an excellent choice for applications where high temperature capabilities and corrosion resistance are important.
Advantages:
● High purity materials (BN>99.5%) and binder-less ceramic.
● No react with metals.
● Highest temperature (2300 °C in inert).
Applications:
● Crucibles for high-purity molten metals.
● Nozzles for specialty alloys.
● Insulators for high temperature.
● Insulators and protective tubes for high-temperature furnaces.
Grade | BN-HB | |
Compositions | BN>99% | |
Binder | Self Binder | |
Density | g/cm3 | 1.9-2.0 |
25°C Volume Resistivity | Ω·cm | >1014 |
Max. Service Temp. (°C) | Oxygen | 900 |
Inert Gas | 2300 | |
High Vacuum | 1800 | |
Flexural Strength | Mpa | 25 |
Compressive Strength | Mpa | 80 |
Coefficient of Thermal Expansion 25-1000°C | 10-6/K | 0-2 |
Thermal Conductivity | W/mK | 50 |
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