Germanium (Ge) Wafers and Substrates

Description

Germanium (Ge) wafers and substrates are a type of semiconductor material used in the production of electronic and optoelectronic devices such as transistors, diodes, and solar cells. Germanium is a Group IV element and has a crystalline structure similar to silicon, but with some important differences in its physical properties.

Germanium wafers and substrates are typically produced using the Czochralski (CZ) method, where a seed crystal is dipped into a melt of molten germanium and slowly pulled out while rotating. The molten germanium solidifies and forms a single crystal as the seed crystal is pulled out.

Once the germanium crystal is grown, it is sliced into thin wafers and polished to a high degree of flatness and smoothness. The resulting germanium wafers and substrates can then be used as a platform for the growth of additional semiconductor layers, which can be doped with impurities to create p-type and n-type regions for device fabrication.

Germanium wafers and substrates have several advantages over other semiconductor materials such as silicon. Germanium has a higher electron mobility than silicon, which means that it can operate at higher frequencies and with lower power consumption. Additionally, germanium has a narrower bandgap than silicon, which makes it suitable for applications such as near-infrared photodetectors and solar cells.

Overall, germanium wafers and substrates are an important semiconductor material for a wide range of electronic and optoelectronic applications, particularly those requiring high-speed performance in the near-infrared wavelength range.

Ge wafers are offer in sizes 2 inch and 4 inch and are used in microelectrinics, optoelectrincs, optics. Ge wafers are used to manufacture solar cells for space and terrestrial applications, optical lens, light emitting diodes (LED) and photodetectors.

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