Germanium (Ge) wafers and substrates are a type of semiconductor material used in the production of electronic and optoelectronic devices such as transistors, diodes, and solar cells. Germanium is a Group IV element and has a crystalline structure similar to silicon, but with some important differences in its physical properties.
Germanium wafers and substrates are typically produced using the Czochralski (CZ) method, where a seed crystal is dipped into a melt of molten germanium and slowly pulled out while rotating. The molten germanium solidifies and forms a single crystal as the seed crystal is pulled out.
Once the germanium crystal is grown, it is sliced into thin wafers and polished to a high degree of flatness and smoothness. The resulting germanium wafers and substrates can then be used as a platform for the growth of additional semiconductor layers, which can be doped with impurities to create p-type and n-type regions for device fabrication.
Germanium wafers and substrates have several advantages over other semiconductor materials such as silicon. Germanium has a higher electron mobility than silicon, which means that it can operate at higher frequencies and with lower power consumption. Additionally, germanium has a narrower bandgap than silicon, which makes it suitable for applications such as near-infrared photodetectors and solar cells.
Overall, germanium wafers and substrates are an important semiconductor material for a wide range of electronic and optoelectronic applications, particularly those requiring high-speed performance in the near-infrared wavelength range.
Ge wafers are offer in sizes 2 inch and 4 inch and are used in microelectrinics, optoelectrincs, optics. Ge wafers are used to manufacture solar cells for space and terrestrial applications, optical lens, light emitting diodes (LED) and photodetectors.
|Crystal Growth Method||CZ|
|Diameter||inch||2",3",4" and 6"|
|Laser Marking||/cm3||Upon request|
|Resistivity (at RT)||ohm.cm||0.005-30||0.005-0.04|
|Etch Pit Density (EPD)||/cm2||-||0|
|Surface||Side1/Side2||E/E, P/E, P/D|
|Package||Cassette or single |