Sn-doped β-Ga2O3 Wafers

Sn-doped β-Ga2O3 Wafers and Substrates

Description

Sn-doped β-Ga2O3 Wafers

Sn-doped β-Ga2O3 wafers are a type of semiconductor wafer made from β-Ga2O3 crystal that has been doped with tin (Sn) impurities. β-Ga2O3, also known as beta gallium oxide, is a wide-bandgap semiconductor material with a bandgap energy of around 4.9 eV, which makes it suitable for applications such as high-power electronics, power conversion, and optoelectronics.

Sn-doped β-Ga2O3 wafers have several advantages over other semiconductor materials such as silicon and gallium nitride. Firstly, β-Ga2O3 has a much wider bandgap than these materials, which means that it can withstand higher voltages and temperatures without breaking down. Secondly, the addition of tin dopants to β-Ga2O3 can increase its electrical conductivity and improve its performance as a semiconductor.

Sn-doped β-Ga2O3 wafers are typically grown using the epitaxial growth technique, where a thin layer of β-Ga2O3 is deposited on a substrate material such as sapphire or silicon. The Sn dopants are introduced into the crystal during the growth process, and the resulting wafer is then polished to a high degree of flatness and smoothness.

Sn-doped β-Ga2O3 wafers are being researched for a range of applications, including power electronics, photovoltaics, and UV photodetectors. They have the potential to enable the development of more efficient and compact devices with higher power densities and operating temperatures.

Orientation (001) (201)  
Dopant Sn Sn Unintentionally-doped Fe
Conductivity n-type n-type n-type Insulating (>1010Ω・cm)
Nd-Na (cm-3) 1×1018 ~ 2×1019 1×1018~9×1018 ≦9×1017 -
Dimensions A-B (mm) 50.8 ±0.3 50.8 ±0.3 50.8 ±0.3 50.8 ±0.3
C-D (mm) 49.5 ±0.3 49.5 ±0.3 49.5 ±0.3 49.5 ±0.3
Thickness (mm) 0.65 ±0.02 0.68 ±0.02 0.68 ±0.02 0.68 ±0.02
Offset angle (degree) [010]:0 ±1 [010]: 0 ±0.4 [010]: 0 ±0.4 [010]:0 ±1
[100]:0 ±1 [102]:-0.7 ±0.4 [102]:-0.7 ±0.4 [102]:-0.7 ±1
FWHM (arcsec) [010]:350 or less [010]:150 or less [010]:150 or less [010]:150 or less
[100]:350 or less [102]:150 or less [102]:150 or less [102]:150 or less
Surface Front CMP CMP CMP CMP
Back Grinding Grinding Grinding Grinding
Orientation (001)
Dopant Sn
Conductivity n-type
Diameter (mm) 100 ±0.5
First orientationflat width (mm) 32.5 ±2.5 
Second orientationflat width (mm) 22.0 ±2.5 
Thickness (mm) 0.65 ±0.02
Front CMP
Back Grinding
Orientation (010)
Dopant Fe
   Insulating (>1010Ω・cm)
Conductivity -
Nd-Na (cm-3) 25 +0.3, -1
Dimensions A-B (mm) 25 +0.3, -1
C-D (mm) 0.5 ±0.02
Thickness (mm) Fig. 3
Offset angle (degree) [001]:0 ±1
[001]:350 or less
FWHM (arcsec) [001]:350 or less
CMP
Surface Front Grinding
Back Fe
Orientation (201)
Dopant Sn Unintentionally-doped Fe
Conductivity n-type n-type

Insulating (>1010Ω・cm)

Nd-Na (cm-3) 1×1018~9×1018 ≦9×1017 -
Dimensions  A-B (mm) 15 ±0.3 15 ±0.3 15 ±0.3
C-D (mm) 10 ±0.3 10 ±0.3 10 ±0.3
Thickness (mm) 0.68 ±0.02 0.68 ±0.02 0.68 ±0.02
Offset angle (degree) [010]: 0 ±0.4 [010]: 0 ±0.4 [010]: 0 ±1
[102]:-0.7 ±0.4 [102]:-0.7 ±0.4 [102]:-0.7 ±1
FWHM (arcsec) [010]:150 or less [010]:150 or less [010]:150 or less
[102]:150 or less [102]:150 or less [102]:150 or less
Surface Front CMP CMP CMP
Back Grinding Grinding Grinding
Orientation (010) 
Dopant Sn Unintentionally-doped Fe
Conductivity n-type n-type Insulating (>1010Ω・cm)
Nd-Na (cm-3) 1×1018~9×1018 ≦9×1017 -
Dimensions  A-B (mm) 15 ±0.3 15 ±0.3 15 ±0.3
C-D (mm) 10 ±0.3 10 ±0.3 10 ±0.3
Thickness (mm) 0.5 ±0.02 0.5 ±0.02 0.5 ±0.02
Offset angle (degree) [102]:0 ±1 [102]:0 ±1 [102]:0 ±1
[102]:0 ±1 [102]:0 ±1 [102]:0 ±1
FWHM (arcsec) [102]:150 or less [102]:150 or less [102]:150 or less
[102]:150 or less [102]:150 or less [102]:150 or less
Surface Front CMP CMP CMP
Back Grinding Grinding Grinding
Orientation (001) 
Dopant Sn Unintentionally-doped Fe
Conductivity n-type n-type Insulating (>1010Ω・cm)
Nd-Na (cm-3) 1×1018~2×1018 ≦9×1017 -
Dimensions  A-B (mm) 15 ±0.3 15 ±0.3 15 ±0.3
C-D (mm) 10 ±0.3 10 ±0.3 10 ±0.3
Thickness (mm) 0.65 ±0.02 0.65 ±0.02 0.65 ±0.02
Offset angle (degree) [010]:0 ±1 [010]:0 ±1 [010]:0 ±1
[100]:0 ±1 [100]:0 ±1 [100]:0 ±1
FWHM (arcsec) [010]:150 or less [010]:150 or less [010]:150 or less
[100]:150 or less [100]:150 or less [100]:150 or less
Surface Front CMP CMP CMP
Back Grinding Grinding Grinding

Order Form

Drag and drop files here or Browse
*You can upload your specification file here. Max 5MB. Allowed File Types: JPG, PNG, PDF

About Semiconductor Electronics

SEMI EL project is a global supplier of materials, equipment, spare parts and supplies for the semiconductor industry.

Learn more...

Get In Touch

 Email: info@semi-el.com

Join Our Community

Sign up to receive email for the latest information.